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| Part Number: | XC18V512PC20I |
|---|---|
| Manufacturer/Brand: | AMD Xilinx |
| Part of Description: | IC PROM SER I-TEMP 3.3V 20-PLCC |
| Datasheets: |
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| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $1.9706 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 3V ~ 3.6V |
| Supplier Device Package | 20-PLCC (9x9) |
| Series | - |
| Programmable Type | In System Programmable |
| Package / Case | 20-LCC (J-Lead) |
| Product Attribute | Attribute Value |
|---|---|
| Package | Tube |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
| Memory Size | 512kb |
| Base Product Number | XC18V512 |




XC18V512PC20I
AMD Xilinx. Y-IC is a quality distributor for AMD Xilinx and we will provide you with the best products, fast delivery, and professional service
512 Kb serial configuration PROM for Xilinx FPGAs, 3.0–3.6 V supply, industrial temperature grade, surface-mount 20-PLCC (9x9) J-lead package, in-system programmable (ISP). Designed to store and deliver FPGA bitstreams at power-up. RoHS non-compliant
512 Kb non-volatile configuration memory for Xilinx FPGAs
Serial PROM architecture optimized for FPGA configuration
In-System Programmable for easy updates without removing the device
3.3 V supply (operates from 3.0 to 3.6 V)
Industrial temperature range −40°C to +85°C
Surface-mount PLCC-20 package with J-leads (9x9 mm body)
Tube packaging for production handling
Base product family XC18V512
Reliable FPGA boot storage with simple, proven serial configuration flow
ISP reduces maintenance time and avoids rework
Industrial-grade temperature range supports harsh environments
Compact footprint with robust J-lead PLCC for stable solder joints
Broad ecosystem support for AMD Xilinx configuration tools and flows
Shipment type Tube for safe handling on the production line
Device package PLCC-20, J-lead (also referred to as 20-LCC), body size 9x9 mm
Material Molded plastic epoxy package with tin-coated copper leads
Pin configuration 20 J-leads around the package perimeter; includes power, ground, serial data, clock, and control pins for configuration and programming
Thermal characteristics Rated for −40°C to +85°C operation; PLCC package supports good mechanical and thermal stability in reflow profiles
Electrical properties 3.0–3.6 V supply, 512 Kb non-volatile memory, serial output for FPGA configuration, in-system programmable
Status Mature legacy configuration PROM family. Some variants are limited in availability and may be approaching end-of-life. RoHS non-compliance should be considered for new designs
Equivalent models (same function, different grade or package) XC18V512PC20C (commercial temperature, PLCC-20), XC18V512VQ44I (industrial temperature, VQFP-44), XC18V512VQ44C (commercial temperature, VQFP-44). Pin-compatibility depends on package; verify against your PCB footprint
Alternative models (newer approaches, not pin-compatible) AMD Xilinx Platform Flash XCF01S/XCF02S families, or external SPI Flash devices used with FPGA Master SPI configuration (e.g., Winbond W25Q series, Micron N25Q). These may require board and flow changes
If you need a drop-in equivalent or lifecycle confirmation, please contact our sales team via the Y-IC website for model matching and latest availability
Primary boot storage for AMD Xilinx FPGAs in industrial control, factory automation, and robotics
Embedded systems requiring reliable FPGA configuration memory
Telecom and networking equipment using Xilinx FPGA cores
Instrumentation, test equipment, and medical electronics with field-upgradable FPGA logic
Avionics and transportation systems within industrial temperature requirements
Y-IC provides the most authoritative and up-to-date datasheet for XC18V512PC20I on our product page. We recommend downloading the datasheet here to get complete electrical, timing, and programming details
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