As artificial intelligence (AI) becomes a key driver of technological progress, the memory market is undergoing a transformation. The traditional approach that emphasizes cost efficiency and price competition for DRAM and NAND flash memory is being replaced by a new model centered on high-performance, high-value-added products.
Samsung’s strategic focus on high-value technologies aims to address mounting pressure from Chinese competitors. China is investing heavily in memory technology development, ramping up production, and improving pricing strategies, which poses fierce competition for established players like Samsung.
In response to these competitive pressures, Samsung is increasing its investments in advanced memory technologies like HBM4 and CXL. These innovations offer significant performance enhancements, making them well-suited for AI-driven applications with high demands and performance requirements.
Recently, Samsung showcased its progress in CXL technology at the Open Compute Project (OCP) Global Summit. The company plans to mass-produce a 256GB CMM-D that complies with the CXL 2.0 protocol by the end of 2024. CXL is a technology designed to enhance data transfer efficiency and speed between CPUs, GPUs, and memory, with the potential to play a pivotal role in next-generation AI and computing workloads.