Leaked documents from the company’s “gChips” division indicate that the Tensor G5, codenamed “Laguna” and set to be used in the 2025 Pixel 10 series, will be manufactured using TSMC’s 3nm “N3E” process, the same process used in the A18 Pro for the iPhone 16 Pro and Apple’s M4 chip.
This represents a significant upgrade in both efficiency and performance compared to the 4nm 4LPE node used by Samsung for the Tensor G4.
Additionally, the leaked documents suggest that the 2026 Tensor G6, codenamed “Malibu,” will be produced using TSMC’s upcoming N3P process, which is also expected to be used in Apple’s A19 chip. Although still a 3nm-class node, the N3P process introduces several improvements, with a 5% increase in frequency (a direct indicator of performance), a 7% boost in power efficiency, and a 4% reduction in chip size.
The adoption of these advanced manufacturing nodes suggests that Google is serious about improving its upcoming Tensor chips. Previous generations were often behind in terms of technology, but adopting modern nodes is a clear step towards increasing competitiveness.