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Samsung ordered 15 EUVs, and Equipment machine is hard to find
TSMC (2330) announced that the 7-nm powerful version and the 5-nm EUV lithography technology have been successfully put into the market. The Korean media reported that Samsung has ordered 15 EUV equipment from the semiconductor equipment manufacturer ASML. In addition, Intel, Micron and the sea Lux also plans to adopt EUV technology, and there are so many porridges. The global semiconductor industry has set off to fight EUV (extreme ultraviolet light) equipment.
TSMC recently announced that the 7-nanometer high-efficiency process leading the industry to introduce EUV lithography technology has helped customers to enter the market in large quantities, and the mass production of 5 nanometers in the first half of 2020 will also be introduced into the EUV process. According to Korean media reports, in order to achieve the goal of becoming the world's No. 1 semiconductor manufacturer in 2030, and surpassing foundry leader TSMC to seize the semiconductor market demand brought by 5G commercialization in the next two to three years, Samsung has already globally The lithography exposure equipment manufacturer ASML orders 15 advanced EUV equipment.
In addition, Britt Turkot, head of the Intel EUV program, said that EUV technology is ready and invests in a lot of technology development. Memory giants Micron and Hynix also plan to introduce EUV technology. However, the current global EUV equipment is only ASML. The industry estimates that ASML can only produce about 30 EUV equipment a year, and the equipment is formed under the investment of major factories. It is difficult to find a machine, and queue up and other equipment.
Due to the EUV's extremely short wavelength of 13.5 nanometers of powerful light technology, it can better analyze the advanced process design, reduce the number of chip production steps and the number of mask layers, and enter the commercial conversion at 5G, high-speed high-frequency characteristics, and the chip is miniature and low. High power requirements have become an important technology to continue Moore's Law.
However, it is difficult to master this complex and expensive system to manufacture a large number of chips. Although Samsung first announced the introduction of EUV in the 7-nanometer process, it has previously reported that production wafer yield and output are insufficient. TSMC said why the 7-nm start EUV has not been imported, and it is necessary to go through a learning curve due to the introduction of new technology. TSMC has successfully learned the experience in the 7-nm powerful version, and can smoothly introduce the 5-nanometer process in the future.
TSMC recently announced that the 7-nanometer high-efficiency process leading the industry to introduce EUV lithography technology has helped customers to enter the market in large quantities, and the mass production of 5 nanometers in the first half of 2020 will also be introduced into the EUV process. According to Korean media reports, in order to achieve the goal of becoming the world's No. 1 semiconductor manufacturer in 2030, and surpassing foundry leader TSMC to seize the semiconductor market demand brought by 5G commercialization in the next two to three years, Samsung has already globally The lithography exposure equipment manufacturer ASML orders 15 advanced EUV equipment.
In addition, Britt Turkot, head of the Intel EUV program, said that EUV technology is ready and invests in a lot of technology development. Memory giants Micron and Hynix also plan to introduce EUV technology. However, the current global EUV equipment is only ASML. The industry estimates that ASML can only produce about 30 EUV equipment a year, and the equipment is formed under the investment of major factories. It is difficult to find a machine, and queue up and other equipment.
Due to the EUV's extremely short wavelength of 13.5 nanometers of powerful light technology, it can better analyze the advanced process design, reduce the number of chip production steps and the number of mask layers, and enter the commercial conversion at 5G, high-speed high-frequency characteristics, and the chip is miniature and low. High power requirements have become an important technology to continue Moore's Law.
However, it is difficult to master this complex and expensive system to manufacture a large number of chips. Although Samsung first announced the introduction of EUV in the 7-nanometer process, it has previously reported that production wafer yield and output are insufficient. TSMC said why the 7-nm start EUV has not been imported, and it is necessary to go through a learning curve due to the introduction of new technology. TSMC has successfully learned the experience in the 7-nm powerful version, and can smoothly introduce the 5-nanometer process in the future.