Intel 300 series chipset turned to Vietnam for production

Intel recently announced that its 300-series chipset will be transferred to the factory in Ho Chi Minh City, Vietnam from July 12.

According to the notification content, Intel's packaging factory for the 300 series chipset mainly involved Q370, C246, HM370, QM370, CM246 and H310. At the same time, Intel stressed that there is no change in performance and specifications of the transfer packaging and testing plant. The main influence is the origin information on the label. It used to be “Made in China” and later “Made in Vietnam”.

As for the reason why Intel migrated the packaging factory, there is no official explanation for the time being. But it is not difficult to guess that this is related to Sino-US trade disputes. It is understood that Intel has factories all over the world, the core wafer manufacturing is mainly in the United States, Ireland and Israel, and the testing and testing factories are mainly in Asia, including Chengdu, China, Ho Chi Minh, Vietnam and Penang, Malaysia. The packaging plants in Costa Rica and Dalian, China, but the former has been closed, the latter has turned to 3D NAND flash memory production.

Although many chip manufacturers are doing assembly and testing work in China, and the value of this part of the work is only 10% of the value of the chip, the design and manufacture of the chip constitutes most of its value.