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Home > News > Infineon and CEVA collaborate to improve the voice user interface of the connected devices

Infineon and CEVA collaborate to improve the voice user interface of the connected devices

  From intelligent speakers to smart TVs, conference systems or intelligent home appliances, voice recognition makes the operation of electronic devices easier and more intuitive. As a result, Voice Search Interface (VUI) search on electronic devices has increased drastically. It is estimated that the average annual growth rate of the smart speaker market will reach 20%.


High-quality MEMS microphones and leading sound processing capabilities are key factors that make voice control devices truly adaptable to everyday environments. In order to stimulate the development of voice control devices and integrate them into a wide range of devices, Infineon launches the VUI Partner Ecosystem. With its technological advantages, Infineon and its partners will provide innovative reference platforms and ready-to-use next-generation voice user interfaces. Currently available solutions come from companies like Aaware, CEVA, Creoir, SoundAI, Sugr, and XMOS.

Oliver Henning, Infineon's Managing Director for Infineon's Energy Management and Diversified Markets, said, "Whether in a noisy environment or in a low voice command, voice recognition can be reliably managed. Key feature of connected devices. The ecosystem is dedicated to the rapid and easy integration of VUI's high-performance functionality into smart devices and applications, and Infineon and our partners will provide system-based reference projects as well as engineering and design capabilities to help our clients successfully complete projects.

The XENSIVTM MEMS microphone breaks the audio circuit limitation

Early voice user interfaces are focused on voice input and response to these key features. With the iterative updating of voice technology and rising consumer expectations, these features are no longer sufficient. For example, the user wants the device to accurately understand his instructions even when whispering or converting rooms.

The Infineon XENSIVTM MEMS microphone introduces a new benchmark for performance and cuts off the current limitations of the audio circuit. The IM69D130 is designed for applications that require low self-noise (high SNR), wide dynamic range, low distortion and high acoustic overload points. The solution supports a distant and flexible audio signal for accurate sound beam management and encompasses other sophisticated audio algorithms that are increasingly used in VUI applications. In addition, different power modes can be selected to meet specific power consumption requirements, such as acoustic speakers.