GlobalFoundries: 3D Arm chip in 12nm FinFET package has been developed

According to foreign media Tom's Hardware, GlobalFoundries announced this week that it has successfully built high-performance 3DArm chips using its 12nm FinFET process.

"These high-density 3D chips will bring new performance and energy efficiency to computing applications such as AI/ML (artificial intelligence and machine learning) and high-end consumer mobile and wireless solutions," said GlobalFoundries.

According to reports, GlobalFoundries and Arm have validated the 3D design test (DFT) method using Groffont's hybrid wafer-to-wafer bonding. This technology supports up to 1 million 3D connections per square millimeter, making it highly scalable and expected to provide a longer lifetime for 12nm3D chips.

For 3D packaging technology, Intel announced its research on 3D chip stacking last year. AMD also talked about the solution of superimposing 3D DRAM and SRAM on its chip.