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Home > News > AMD will release embedded APU processor

AMD will release embedded APU processor

After the 2011 low-power platform for small-volume mobile and desktop devices, the AMD Fusion APU Fusion family is adding new features today, and the "Embedded G-Series Platform" for embedded devices is officially debuted. This is also the world's first embedded platform for CPU and GPU integration.

The G series embedded APU processor and the previous E series and C series use the same core architecture design, which is also a single chip integrated x86 Bobcat low power core, DX11 level graphics core, UVD3 video decoding engine, single channel DDR3 memory. The controller is only optimized for the special needs of embedded applications, and the products are more abundant. There are five models:

G-T56N: equivalent to Zacate E-350, dual core, clocked at 1.6GHz, level 1 cache 64KB, level 2 cache 512KB × 2, graphics core Radeon HD 6310, frequency 500MHz, memory support single channel DDR3-1066, thermal design Power consumption is 18W.

G-T48N: New model, clocked at 1.4GHz, others the same as above.

G-T52R: equivalent to Zacate E-240, single core, clocked at 1.5GHz, level 1 cache 64KB, level 2 cache 512KB, others the same as above.

G-T40N: equivalent to Ontario C-50, dual core, clocked at 1.0GHz, level 1 cache 64KB, level 2 cache 512KB × 2, graphics core Radeon HD 6250, frequency 280MHz, memory support single channel LVDDR3-1066 (low voltage version ), thermal design power consumption of 9W.

G-T44R: equivalent to the Ontario C-30, single core, clocked at 1.2GHz, level 1 cache 64KB, level 2 cache 512KB, others the same as above.

All of the above processors are fabricated on TSMC's 40nm process, with a 413-pin topless miniature BGA package and an area of ​​19 x 19 mm. The I/O control chipset is matched with A55M and A55E, all of which are single-chip design, 605-pin topless FCBGA package, thermal design power consumption of 2.7-5.9W, area 23×23 mm, total platform area 890 Square millimeters.

The difference between the two models is that the A55M is connected to the processor via the PCI-E 1.0 bus. It does not support PCI, does not support RAID 0/1/5/10, and does not have FIS-based switching, Ethernet MAC, EEE, and A55E upgrade. It is a PCI-E 2.0 bus and has all of the above features.

AMD G series embedded platforms have been widely adopted by the industry, and dozens of manufacturers have already launched or are about to launch related products, including Advansus, Compulab, Congatec, Fujitsu, Haier, and Vectra ( iEi), Kontron, Mite, Quixant, Sintrones, Starnet, WebDT, Wyse, product types include digital signage, connected set-top boxes, IP TV, mobile and desktop thin clients, gaming machines, POS sales terminals, kiosks , SFF minicomputer, single board computer (SBC) and so on.

AMD also provides full support for ecosystem development, including multiple BIOS options, Windows/Linux and real-time operating system support, integrated OpenCL programming environment, source-level debugging tools, dedicated design support teams, rich online resources, and more. AMD also quoted Shane Rau, head of research at IDC's computing and storage semiconductor division, as saying that embedded system processors will grow at double-digit annual growth rates of more than 10% over the next five years.